发明名称 METHOD OF MANUFACTURING LED PACKAGE
摘要 PURPOSE: A method of manufacturing an LED package is provided to improve optical efficiency by forming a reflector with a white tiO2, znO, lithopone, znS, baSO4, siO2 and PTFE. CONSTITUTION: In a device, a sheet(10) for a lower plate and a white sheet(20) for a reflector are prepared. A via hole(10a) is formed by punching the sheet, and the via hole is filled with the conductor paste. Electrode patterns(12a,12b,12c) are formed on the sheet having a via hole. The sheet and electrode pattern are combined through a plastic process. A white sheet for the reflector is laminated on the sheet for the lower plate. The lower plate and a white sheet for reflector are rigidly combined through a thermal process. A plurality of unit elements are formed by a cutter.
申请公布号 KR20090130638(A) 申请公布日期 2009.12.24
申请号 KR20080056355 申请日期 2008.06.16
申请人 AMOLEDS CO., LTD. 发明人 CHOI, WON GIL;PARK, JONG WEON;LEE, GIL SUN
分类号 H01L33/60 主分类号 H01L33/60
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