摘要 |
The invention relates to a fixing system for electronic and/or electric components-called E components in short-such as chips, circuits, transponders, cables (10) etc., with at least one first fastening element (12) having individual closure parts (14, 16) which, in interaction with corresponding closure parts (22) of a further fastening element (20), form an adhesive closure which can be opened and closed repeatedly, wherein the respective E component can be connected to a support (30). Owing to the fact that the further fastening element (20) can be connected to the support (30), at least part of which has an adhesive layer and/or which is composed of an embedding compound, said adhesive layer or embedding compound producing the direct connection of the respective E component to the further fastening element (20) assignable to it, a solution is provided which requires only a very little amount of installation space.
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