PAD LAYOUT STRUCTURE OF DRIVER IC CHIP

摘要

PURPOSE: A pad layout structure of a driver IC chip is provided to arrange power pads inside the driver IC chip in four directions of an edge of a chip, thereby minimizing problems when the driver IC chip and a liquid crystal panel are bonded. CONSTITUTION: Power pads(341~344) comprise the first to fifth power pads. The first power pad(341a) supplies the first power to a driver IC chip. The second power pad(341b) supplies the second power to the driver IC chip. The third power pad(341c) supplies the third power to the driver IC chip. The fourth power pad(341d) supplies the fourth power to the driver IC chip. The power pad is arranged in four edges of the driver IC chip.