发明名称 SOLDERING PROCESS
摘要 <p>A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead­free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.</p>
申请公布号 HK1105918(A1) 申请公布日期 2009.12.24
申请号 HK20070111250 申请日期 2007.10.18
申请人 P. KAY METAL, INC. 发明人 KAY, LAWRENCE, C.;SEVERIN, ERIK, J.;AGUIRRE, LUIS, A.
分类号 B23K;B23K3/06;B23K31/02;H05K;H05K3/34 主分类号 B23K
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