| 摘要 |
A camera module includes: a lens unit including a casing portion and a lens; and a substrate portion on which an image pick-up element is mounted. The camera module is assembled in combination of the lens unit and the substrate portion in an arrangement in which the lens and the image pick-up element are opposed to each other. The substrate portion includes: a first substrate including one of surfaces on which the image pick-up element is mounted; an infrared filter supported on a light receiving face of the image pick-up element; and a second substrate supported on a surface of the infrared filter which is opposed to the lens. The second substrate includes an opening portion disposed in alignment with the infrared filter so as not to intercept an incident light. A circuit component is mounted on the second substrate. |
