| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve such a problem that, when a through-hole electrode and a rear-surface wire are formed on a rear surface of a chip, a convex portion is formed on the rear surface of the chip due to a rear-surface wiring pad which is a part of the through-hole electrode and the rear surface wire, thereby causing the air leakage when the chip is sucked, and therefore, the reduction of the sucking force of the chip occurs. <P>SOLUTION: A concave portion 100 is formed in advance in a region where a rear-surface wiring pad 4d and a rear-surface wire 4e are formed. The rear-surface wiring pad 4d and the rear-surface wire 4e are provided inside the concave portion 100. Thus, a flatness of the rear surface of the chip 1C is ensured by a convex portion caused by thicknesses of the rear-surface wiring pad 4d and the rear-surface wire 4e, so that the reduction of the sucking force does not occur when the chip 1C is handled. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
