| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet which can suitably be used as a mold release film in a process for producing a printed circuit board, a flexible printed circuit board, a multi-layered printed circuit board, or the like, has excellent flexibility at high temperature, excellent heat resistance, an excellent mold release property, and an excellent non-staining property, and can easily be scrapped after used. SOLUTION: This sheet having the excellent flexibility at high temperatures, the excellent heat resistance, the excellent mold release property, and the excellent non-staining property and can easily be scrapped after used, comprises a resin composition having polar groups and having a halogen content of≤5 wt. %, and has a storage elastic modulus of 20 to 100 MPa at 170°C, a tensile breaking elongation of≥500% at 170°C, and a dimensional change rate of≤1.5%, when pressurized with a load of 3 MPa for 60 min at 170°C. COPYRIGHT: (C)2004,JPO |
