发明名称 |
Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus |
摘要 |
The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).
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申请公布号 |
US2009314526(A1) |
申请公布日期 |
2009.12.24 |
申请号 |
US20070162770 |
申请日期 |
2007.01.29 |
申请人 |
KYOCERA CORPORATION |
发明人 |
NAGASAWA TADASHI;SHIRAI MASAHARU;KUME KENJI;TSUKADA YUTAKA |
分类号 |
H05K1/03;B32B3/02;H05K1/11;H05K1/16 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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