发明名称 |
CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMPONENT MOUNTED STRUCTURE |
摘要 |
A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.
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申请公布号 |
US2009315178(A1) |
申请公布日期 |
2009.12.24 |
申请号 |
US20080522239 |
申请日期 |
2008.03.04 |
申请人 |
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发明人 |
SAKURAI DAISUKE;YAGI YOSHIHIKO |
分类号 |
H01L23/488;H01B5/00;H01R43/02 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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