| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive which does not allow deformations such as warpage to be caused when a semiconductor element is stuck to a glass substrate and which is used when the semiconductor element is stuck to the glass substrate. <P>SOLUTION: The adhesive 30 includes an epoxy resin, a curing agent for curing the epoxy resin and a polyester resin having the glass transition temperature of >6°C and <45°C and softening point of≥105°C. An adhesive composition, which is obtained by further adding a phenoxy resin and an electrically conductive particle 31 to the adhesive, and an electrical apparatus 1, which is obtained by sticking the substrate 10 to the semiconductor element 20 by using the adhesive, are provided. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
