| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device that achieves excellent reflow soldering while achieving preheating and actual heating by a small and simple structure, and a soldering method. SOLUTION: A conveyance part 140 carries a workpiece 10 in a vapor phase 114 from the upper side toward the lower side, stops and holds the workpiece in a low-density vapor phase 114b for only a first prescribed period of time t1, further moves the workpiece to the lower side, stops and holds the workpiece in a high-density vapor phase 114a for only a second prescribed period of time t2, and then carries out the workpiece from the high-density vapor phase to the upper side of the vapor phase 114. Alternatively, a heating part 120 makes the vapor phase 114 as the low-density vapor phase (114b), wherein the vapor phase becomes a prescribed low density, for the first prescribed period of time t1 by a prescribed first heating capability H1 while the workpiece 10 is being stopped and held in the vapor phase 114, and then makes the vapor phase 114 as the high-density vapor phase (114a), wherein the vapor phase becomes a high density higher than the low density, for the second prescribed period of time t2 by a second heating capability H2 higher than the first heating capability H1. COPYRIGHT: (C)2010,JPO&INPIT |
