| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a waveguide connection which does not have impedance mismatching. Ž<P>SOLUTION: In a waveguide connection structure for connecting a first dielectric substrate 100 having a waveguide structure and a second dielectric substrate 200 having a waveguide structure via a plurality of bumps 30, formed at least around the waveguide structures between the first dielectric substrate 100 and the second dielectric substrate 200, a dummy waveguide constituted of the plurality of bumps 30 is formed in a ridge waveguide structure. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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