| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulated metal base circuit board for reducing a warpage behavior generated by a thermal load in the packaging process of a substrate, and to provide a hybrid integrated circuit module using the circuit board. Ž<P>SOLUTION: The insulated metal base circuit board is provided with a conductor metal on metal foil via an insulating layer wherein the area of the conductor metal is not smaller than 50% of the entire area of the circuit surface of the insulated metal base circuit board, and the ratio of the circuit portion in the conductor metal is not smaller than 5% and not larger than 50% at least in one section passing through the center of gravity at the side of the circuit surface of the insulated metal base circuit board. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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