| 摘要 |
Example packaged integrated circuit (IC) chips having conformal electromagnetic shields and methods to form the same are disclosed. A disclosed packaged IC chip comprises an IC attached to a first surface of a substrate, the substrate having a conductive pad on the first surface, a first conductive element electrically coupled to the conductive pad on the first surface of the substrate, a molding compound to encapsulate the IC and the first conductive element, the molding compound exposing a surface of the first conductive element, a conformal electromagnetic shield on the molding compound in electrical contact with the exposed surface of the first conductive element, and an externally exposed second conductive element attached to a second surface of the substrate, the second conductive element in electrical contact with the first conductive element.
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