发明名称 |
COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED |
摘要 |
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
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申请公布号 |
US2009316360(A1) |
申请公布日期 |
2009.12.24 |
申请号 |
US20080143289 |
申请日期 |
2008.06.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;ELLSWORTH, JR. MICHAEL J.;FURMAN BRUCE K.;IYENGAR MADHUSUDAN K.;LAURO PAUL A.;SCHMIDT ROGER R.;SHIH DA-YUAN;SIMONS ROBERT E. |
分类号 |
H05K7/20;B23K31/02;F28F7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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主权项 |
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地址 |
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