| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a phenomenon that when heat is generated locally at a bonding point, the heat is efficiently conducted over a wide range on a surface of a semiconductor chip and the bonding point is locally overheated to deteriorate bonding strength between a wire and a surface electrode. <P>SOLUTION: A coating layer 20 consisting of a material having higher thermal conductivity than the surface electrode 16 where the wire 22 is bonded, is formed on a surface of the surface electrode 16. When the surface of the surface electrode 16 where the wire 22 is bonded is coated with the material which has the higher heat thermal conductivity than the surface electrode 16, heat is efficiently conducted over a wide range of the surface of a semiconductor chip 14 to prevent the phenomenon that the bonding point is locally overheated. Alternatively, the wire may be bonded to the surface electrode through the surface coating layer. In this case, the coating layer thicker than the surface electrode is formed of the material which has the higher thermal conductivity than the surface electrode, on the surface of the surface electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT |
