| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable accurate prescription of a relative position between boards with a simple configuration and attainment of accurate joint therebetween conveniently, simply and easily. Ž<P>SOLUTION: First and second printed wiring circuit boards 10 and 13 having bonding patterns 11 and 15 formed thereon are bonded to each other with a prepreg dielectric layer 14 disposed therebetween to prescribe mutually bonded patterns 11 and 15 to be positioned close to each other. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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