发明名称 |
Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same |
摘要 |
Disclosed are semiconductor die packages comprising flexible modules having passive components, with the flexible modules and one or more semiconductor dice disposed in a stacked relationship, systems using the same, and methods of making the same. In one exemplary package embodiment, one or more semiconductor dice are disposed on a leadframe that is disposed in a stacked relationship with the flexible module. In another embodiment, one or more semiconductor dice are attached to a surface of a flexible module.
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申请公布号 |
US2009315163(A1) |
申请公布日期 |
2009.12.24 |
申请号 |
US20080143680 |
申请日期 |
2008.06.20 |
申请人 |
JOHNSON TERRY;HAWKS DOUG;LIU YONG |
发明人 |
JOHNSON TERRY;HAWKS DOUG;LIU YONG |
分类号 |
H01L23/495;H01L21/00 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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