发明名称 |
Semiconductor package with heat sink, stack package using the same and manufacturing method thereof |
摘要 |
A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.
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申请公布号 |
US2009317947(A1) |
申请公布日期 |
2009.12.24 |
申请号 |
US20090461640 |
申请日期 |
2009.08.19 |
申请人 |
KWON HEUNG-KYU;KIM TAE-HUN;PARK SUNG-YONG |
发明人 |
KWON HEUNG-KYU;KIM TAE-HUN;PARK SUNG-YONG |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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