发明名称 |
Solid-state imaging apparatus and method for manufacturing the same |
摘要 |
A solid-state imaging apparatus and method for manufacturing the imaging apparatus. A solid-state imaging apparatus with reduced thickness and/or mounting area by forming an aperture in a board and placing a solid-state semiconductor imaging chip, an image processing semiconductor chip, and/or a combination imaging/processing chip within the aperture.
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申请公布号 |
US2009315130(A1) |
申请公布日期 |
2009.12.24 |
申请号 |
US20040915334 |
申请日期 |
2004.08.11 |
申请人 |
RO YOUNG-HOON;KWON YOUNG-SHIN;MOK SEUNG-KON |
发明人 |
RO YOUNG-HOON;KWON YOUNG-SHIN;MOK SEUNG-KON |
分类号 |
H01L27/14;H01L31/0232;H01L23/00;H01L27/146;H01L31/18;H04N5/225;H04N5/335 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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