发明名称 Solid-state imaging apparatus and method for manufacturing the same
摘要 A solid-state imaging apparatus and method for manufacturing the imaging apparatus. A solid-state imaging apparatus with reduced thickness and/or mounting area by forming an aperture in a board and placing a solid-state semiconductor imaging chip, an image processing semiconductor chip, and/or a combination imaging/processing chip within the aperture.
申请公布号 US2009315130(A1) 申请公布日期 2009.12.24
申请号 US20040915334 申请日期 2004.08.11
申请人 RO YOUNG-HOON;KWON YOUNG-SHIN;MOK SEUNG-KON 发明人 RO YOUNG-HOON;KWON YOUNG-SHIN;MOK SEUNG-KON
分类号 H01L27/14;H01L31/0232;H01L23/00;H01L27/146;H01L31/18;H04N5/225;H04N5/335 主分类号 H01L27/14
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