| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a thin plate, optionally changing a dipping angle of a substrate and improving flexibility of dipping conditions. SOLUTION: A dipping mechanism 6 includes a pair of arm members 13 revolving around a horizontal first rotation center 12, a rotation shaft member 14 having a horizontal second rotation center near the top end of the arm member 13, and a pedestal holding a base plate on the rotation shaft member 14, wherein the pair of arm members 13 pinch the rotation shaft member 14 is provided with a balancer 15 disposed in the opposite side to the rotation shaft member 14. The balancer 15 is composed of a cylindrical member and connects the pair of arm members 13. COPYRIGHT: (C)2010,JPO&INPIT
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