发明名称 |
Semiconductor package with joint reliability |
摘要 |
A semiconductor package with improved joint reliability and a method of fabricating the semiconductor package are disclosed. A conductive connector may be formed on a surface of a semiconductor wafer on which semiconductor devices may be arranged. A first insulating layer including a first opening through which a portion of the connection pad is exposed may be formed on the connection pad and the semiconductor wafer. A rewiring line electrically connected to an exposed portion of the connection pad may be formed on the first insulating layer. A second insulating layer including a second opening through which a portion of the rewiring line is exposed may be formed on the rewiring line and the first insulating layer. A connection terminal including one or more entangled wires may be formed on an exposed portion of the rewiring line so as to be electrically connected to the rewiring line.
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申请公布号 |
US2009315177(A1) |
申请公布日期 |
2009.12.24 |
申请号 |
US20090453103 |
申请日期 |
2009.04.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHUNG HYUN-SOO;CHO JAE-SHIN;HWANG SEONG-DEOK;KIM JUM-GON;KIM KI-HYUK |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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