发明名称 SUBSTRATE CLEANING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a cleaning apparatus for cleaning a substrate and a substrate transfer mechanism. Ž<P>SOLUTION: A drain pipe 77 is connected to the bottom portion of a cup body 76, and the cup body is provided while surrounding a mounting table 74 for mounting a wafer W. This cup body 76 is housed in a cabinet 60. In the cabinet 60, a cleaning head 63 for cleaning an arm body 53 is provided at a place which is a carry-in route of the wafer W and is outside of the cup body 76, and a shower head 71 for cleaning the wafer W is provided above the mounting table 74. The cleaning head 63 is so extended as to be orthogonal to the approaching direction of the arm body 53, and the length in the longitudinal direction of the cleaning head is so formed as to cover the whole width of the arm body 53. The cleaning head 63 and the shower head 71 are connected to a shared cleaning liquid supply source 64A and a shared purge gas supply source 65A. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009302585(A) 申请公布日期 2009.12.24
申请号 JP20090223346 申请日期 2009.09.28
申请人 TOKYO ELECTRON LTD 发明人 ISHIDA YOSHITAKA;NAKAHARADA MASAHIRO;YAMAMOTO TARO
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
代理机构 代理人
主权项
地址