发明名称 Printed Board
摘要 A printed board is provided, which includes at least a first connecting electrode and a second connecting electrode. A solder is provided over the first connecting electrode and the second connecting electrode, and a chip component is provided over the solder. The chip component includes a first terminal electrode and a second terminal electrode. The first connecting electrode is overlapped with the first terminal electrode and is electrically connected to the first terminal electrode through the solder. The second connecting electrode is overlapped with the second terminal electrode and is electrically connected to the second terminal electrode through the solder. Two corner portions of each of the first connecting electrode and the second connecting electrode are overlapped with two corner portions of each of the first terminal electrode and the second terminal electrode.
申请公布号 US2009314535(A1) 申请公布日期 2009.12.24
申请号 US20090483102 申请日期 2009.06.11
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 KUSUMOTO NAOTO
分类号 H05K1/16 主分类号 H05K1/16
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