| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable component built-in printed wiring board which does not increase manufacturing costs, prevents the formation of a void between a chip component and a base plate, and prevents the occurrence of an electrical connection failure on an inner layer when an electronic component is soldered to an outer layer. <P>SOLUTION: The component built-in printed wiring board includes a printed wiring board intermediate element which has a component-attached inner layer substrate made by disposing a chip component along a through-hole on a base plate composed of an insulating resin plate having the through-hole and a wiring layer, the chip component having an electrode soldered to the wiring layer and being thicker than the base plate, a first insulating resin layer formed by laminating open prepregs on the side of the chip component on the component-attached inner layer substrate, the open prepregs avoiding the chip component through prepreg openings, and a second insulating resin layer formed by laminating open prepregs on the surface opposite to the chip component formation surface on the component-attached inner layer substrate. The component built-in printed wiring board also includes a wiring layer as an outer layer on the printed wiring board intermediate element, and a through-hole penetrating the printed wiring board intermediate element. <P>COPYRIGHT: (C)2010,JPO&INPIT |
