| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing apparatus that effectively remove particles gathered in a vacuum chamber. <P>SOLUTION: A dust collection body 40a which gathers particles P from a wafer 8A mounted on a wafer mount base 18 by thermal migration is provided in a load lock chamber 26 of the processing apparatus, and a subsonic gas is flowed to a space H<SB>2</SB>sealed between the dust collection body 40a and wafer mount base 18 as a means of removing particles from the dust collection body 40 to collect the particles P sticking on the dust collection body to outside the load lock chamber 26. <P>COPYRIGHT: (C)2010,JPO&INPIT |
