发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE FORMED FROM THE POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition with a low water-absorption property having a wide moldable temperature range, being excellent in melt moldability, being excellent in chemical-resistance and hydrolysis-resistance and capable of further attaining sufficient slide property of a die and a molded article at molding and/or a short molding time, and a molded article formed from the polyamide resin composition. SOLUTION: The polyamide resin composition contains a polyamide resin in which a dicarboxylic acid component comprises oxalic acid, a diamine component comprises 1,9-nonanediamine and 2-methyl-1,8-octanediamine and a molar ratio of 1,9-nonanediamine to 2-methyl-1,8-octanediamine is 1:99-99:1 and a mold release agent. The molded article is formed from the polyamide resin composition. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009298857(A) 申请公布日期 2009.12.24
申请号 JP20080152308 申请日期 2008.06.10
申请人 UBE IND LTD 发明人 MAEDA SHUICHI;KURACHI KOICHIRO;SHIMOKAWA MASAHITO;NAKAGAWA TOMOYUKI;OKUSHITA YOJI;FUJIMURA HIDEKI
分类号 C08L77/00;C08K3/00;C08K5/00 主分类号 C08L77/00
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