| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an excellent apparatus and method achieving highly sensitive defect-detecting performance without bringing about degradation of focusing accuracy, even in case contrast at defective portions is not enough obtained due to special features of a wafer. Ž<P>SOLUTION: An SEM system appearance inspection method and a device thereof, in which, after loading a sample on a portable stage and carrying out measurement of a height of the sample, electron beams are scanned over the sample to find a defective part from an image thus obtained, include a height measurement with a correction processing function through stage movement. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
