| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve polishing quality of a peripheral portion of a semiconductor wafer as a workpiece. Ž<P>SOLUTION: A rotating head 30 includes a main rotor 31 and a sub-rotor 32 which are isolated by a polishing space 34 and connected by a connecting rod 33. The workpiece W is held on a workpiece holding table and capable of being freely reciprocated in the direction of a rotational axis O2 of the rotating head 30. The main rotor 31 is fitted with an end face polishing arm 41a for polishing an edge face of one face of the workpiece W and the sub-rotor 32 is fitted with an end face polishing arm 42a for polishing an edge face of the other face of the workpiece W. The main rotor 31 and the sub-rotor 32 have peripheral face polishing arms 51, 52 respectively for polishing the peripheral face of the workpiece W. When the rotating head 30 is rotated, edge faces on both front and rear faces, and the peripheral face are simultaneously polished. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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