发明名称 PRINTED CIRCUIT BOARD WITH ELECTRONIC COMPONENTS EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME
摘要 <p>PURPOSE: An electronic component embedded printed circuit board and a fabrication method thereof are provided to disperse circuit concentration by locating a connection part and a via between an electronic component and circuit layers. CONSTITUTION: An electronic component embedded printed circuit board(100) includes a core substrate(105) and an electronic component(107). A core substrate has a cavity(103). The core substrate has internal circuit layers(102). The internal circuit layers are arranged on both sides of the core substrate. The electronic component is arranged in the cavity of the core substrate. The electronic component embedded printed circuit board further includes a connection part(110) and insulating layers(109,111). The connection part connects an electrode port of the electronic component and the internal circuit layers electrically. The insulating layers are stacked on both sides of the core substrate by covering the electronic component. The fabrication method disperses circuit concentration using the electronic component embedded printed circuit board.</p>
申请公布号 KR20090130727(A) 申请公布日期 2009.12.24
申请号 KR20080056487 申请日期 2008.06.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 BAEK, SANG JIN;CHUNG, YUL KYO;JUNG, HYUNG MI;BYUN, JUNG SOO
分类号 H05K1/18 主分类号 H05K1/18
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