| 摘要 |
PURPOSE: A high-reliability PCB manufacturing method is provided to perform image processes of two times until an etch process after panel plating, thereby preventing the defect of a surface circuit and a conductor fault in a hole. CONSTITUTION: After an original plate is cut, a hole is created on the original plate with a CNC(Computer Numerical Control) drill. The first copper plating of the original plate is performed. The first image process of the original plate is performed. The second copper plating of the original plate is performed. The TIN plating of the original plate is performed. The first image stripping of the original plate is performed. The second image process of the original plate is performed. The first copper plating is coated in the thickness of 10 to 20 micron. The second copper plating is coated in the thickness of 5 to 20 micron.
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