发明名称 EPOXY RESIN COMPOSITION FOR SEALING AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, excellent in flowability when molding, suppressed in blocking during long storage and flowability decrease with time during molding and having excellent storage stability, and also to provide a method for manufacturing the same. SOLUTION: The epoxy resin composition used for sealing includes, as necessary components, an epoxy resin (A), a phenol resin (B), a curing promoter (C) and an inorganic filler (D). The composition includes the body of the resin composition in a powder, granular or sheet form including as main components the epoxy resin (A), phenol resin (B), curing promoter (C) and inorganic filler (D), and a fine silica powder (E) coating the surface of the body of the resin composition. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009298961(A) 申请公布日期 2009.12.24
申请号 JP20080156753 申请日期 2008.06.16
申请人 KYOCERA CHEMICAL CORP 发明人 HIDAKA HIROMI;IBUKI KOICHI;UCHIDA NOBUHIKO
分类号 C08J7/06;C08G59/62 主分类号 C08J7/06
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