发明名称
摘要 The present invention relates to processes for application of a metal layer on a substrate via deposition of a metal from a metal salt solution by a chemical and/or electroplating method, a significant factor in these processes being that carbon nanotubes are present in the substrate surface. The present invention moreover relates to the use of carbon nanotubes for application of a metal layer on a substrate.
申请公布号 JP2009545671(A) 申请公布日期 2009.12.24
申请号 JP20090522234 申请日期 2007.07.27
申请人 发明人
分类号 C25D5/56;C01B31/02;C08K3/04;C08L101/00;C23C18/20 主分类号 C25D5/56
代理机构 代理人
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