| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaner with a deposit discharge mechanism capable of surely preventing a thinned semiconductor wafer from cracking by efficiently removing deposit such as tape waste without allowing the deposit to be re-adhered thereto; and a method of cleaning a chuck table using the cleaner. SOLUTION: This cleaner 1 with a deposit discharge mechanism for removing the unnecessary deposit 20 adhered onto the suction surface 16a of the chuck table 15 for sucking the wafer includes a cleaner body 2 having a blade section 7a for cutting out the deposit 20 and an arresting section 6 for arresting the cut deposit 20 and a discharge means 10 for sucking and discharging the arrested deposit 20. An opening 8 for advancing the deposit 20 adhered onto the suction surface 16a of the chuck table 15 into the cleaner body 2 is formed in the cleaner body 2. COPYRIGHT: (C)2010,JPO&INPIT
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