| 摘要 |
<p>An interposer 10 is constructed with a substrate body 12 having first and second through-holes 14,16, a capacitor 20 formed by a laminating dielectric layer 24 and a second electrode portion 26 on a first electrode portion 22, which is structured on inner surfaces of first and second through-holes 14,16 and on the first surface of the substrate body 12. An insulation layer 18 is formed by filling insulation material in the space within the first through-hole 14 surrounded by second electrode portion 26, and a first post 40 passes through the insulation layer 18, one end being electrically connected to the first electrode portion 22, while the first post 40 is electrically insulated from the second electrode portion 26. Furthermore, a second post 42 is formed in the second through-hole 16, and is connected to the second electrode portion 26 at its peripheral surface while being electrically insulated from the first electrode portion 22.</p> |
