| 摘要 |
<p>Provided is an epoxy resin molding material for semiconductor sealing purposes, obtained by melt-milling at least (1-A) crystalline poly-a-olefin of melting point 30 to 90°C in a powder and/or spray-like form of particle diameter 75 µm or below, (1-B) epoxy resin and (1-C) inorganic filler, the epoxy resin molding material containing from 0.2 to 5 mass% of said crystalline poly-a-olefin. Also provided are an excellent epoxy resin molding material for semiconductor sealing purposes having a very low failure rate (due to incomplete filling, wire displacement, void formation, semiconductor movement etc.) on molding the resin seal of a semiconductor element by transfer molding, and a method for producing same, wherein the epoxy resin composition for semiconductor sealing purposes is produced by spraying and adding the crystalline poly-a-olefin of melting point 30 to 90°C in the molten state. Furthermore, provided is an epoxy resin sheet for semiconductor sealing purposes having a sealing layer comprising sealing material wherein at least (2-A) crystalline poly-a-olefin of melting point 30 to 90°C in a powder and/or spray-like form of particle diameter 50 µm or below, (2-B) epoxy resin and (2-C) inorganic filler have been melt-milled and wherein from 0.2 to 5 mass% of said crystalline poly-a-olefin is included, and a protective film on one side or both sides of said sealing layer. Also provided are an excellent epoxy resin sheet for semiconductor sealing purposes having a very low failure rate (due to incomplete filling, wire displacement, void formation, semiconductor movement etc.) on molding the resin seal of a semiconductor element by press-bond molding, and a method for producing same, said method including a process wherein crystalline poly-a-olefin of melting point 30 to 90°C is sprayed in the molten state and a sealing material is produced, and a process wherein crystalline poly-a-olefin of melting point from 30 to 90°C is coated or sprayed in the molten state onto a protective film and a peelable layer is formed.</p> |
