发明名称 |
METHOD FOR INTEGRATING PRE-FABRICATED CHIP STRUCTURES INTO FUNCTIONAL ELECTRONIC SYSTEMS |
摘要 |
<p>A method (and resulting structure) for fabricating a sensing device. The method includes providing a substrate comprising a surface region and forming an insulating material overlying the surface region. The method also includes forming a film of carbon based material overlying the insulating material and treating to the film of carbon based material to pyrolyzed the carbon based material to cause formation of a film of substantially carbon based material having a resistivity ranging within a predetermined range. The method also provides at least a portion of the pyrolyzed carbon based material in a sensor application and uses the portion of the pyrolyzed carbon based material in the sensing application. In a specific embodiment, the sensing application is selected from chemical, humidity, piezoelectric, radiation, mechanical strain or temperature.</p> |
申请公布号 |
EP1680803(A4) |
申请公布日期 |
2009.12.23 |
申请号 |
EP20040810125 |
申请日期 |
2004.10.29 |
申请人 |
CALIFORNIA INSTITUTE OF TECHNOLOGY |
发明人 |
TAI, YU-CHONG;RODGER, DAMIEN, C. |
分类号 |
H01L21/48;H01L;H01L21/44;H01L21/60;H01L21/68;H01L23/02;H01L23/538;H01L29/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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