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发明名称
电路基板上的软性排线
摘要
申请公布号
CN301090341D
申请公布日期
2009.12.23
申请号
CN200830139230.1
申请日期
2008.07.10
申请人
达昌电子科技（苏州）有限公司;禾昌兴业电子(深圳)有限公司
发明人
王建淳
分类号
13-03
主分类号
13-03
代理机构
代理人
主权项
地址
215129江苏省苏州市高新技术开发区枫桥工业园华山路158-86号
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