发明名称 |
Silicon carbide semiconductor device and method for fabricating the same |
摘要 |
<p>An inventive semiconductor device is provided with: a silicon carbide substrate 1 ; an n-type high resistance layer 2 ; well regions 3 provided in a surface region of the high resistance layer 2 ; a p + contact region 4 provided within each well region 3 ; a source region 5 provided to laterally surround the p + contact region 4 within each well region 3 ; first source electrodes 8 provided on the source regions 5 and made of nickel; second source electrodes 9 that cover the first source electrodes 8 and that are made of aluminum; a gate insulating film 6 provided on a portion of the high resistance layer 2 sandwiched between the two well regions 3 ; a gate electrode 10 made of aluminum; and an interlayer dielectric film 11 that covers the second source electrodes 9 and the gate electrode 10 and that is made of silicon oxide.</p> |
申请公布号 |
EP1460681(B1) |
申请公布日期 |
2009.12.23 |
申请号 |
EP20040006581 |
申请日期 |
2004.03.18 |
申请人 |
PANASONIC CORPORATION |
发明人 |
KUSUMOTO, OSAMU;KITABATAKE, MAKOTO;TAKAHASHI, KUNIMASA;YAMASHITA, KENYA;MIYANAGA, RYOKO;UCHIDA, MASAO |
分类号 |
H01L21/28;H01L21/335;H01L21/04;H01L23/485;H01L29/24;H01L29/45;H01L29/78;H01L29/808;H01L29/812 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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