| 摘要 |
PURPOSE:To improve chip-obtaining recovery, by providing a target pattern in such manner as to make its straight-line section to become in parallel with wafer scribing direction. CONSTITUTION:Chips C1-C3 are arranged on a wafer. And scribing areas (dicing areas) S1 and S2 exist between the chips in the directions of X and Y. Now, detections of distances between the lines are executed by scanning a target pattern along the direction (arrow E) inclined by 45 deg. toward the X and Y directions. As it is possible, by doing so, to provide the target pattern without sacrificing a part of the chip, the production recovery can be improved. |
