发明名称 METHOD FOR MANUFACTURING MULTISTEP SUBSTRATE
摘要 <p>A plurality of masks, which are composed of different materials and have different peeling means, respectively, are formed to overlap with each other on the main surface of a substrate.  Then, step process is performed by sequential dry etching by using plasma, corresponding to the shapes of the masks, and a multistep substrate having a plurality of steps is obtained.</p>
申请公布号 WO2009154173(A1) 申请公布日期 2009.12.23
申请号 WO2009JP60883 申请日期 2009.06.15
申请人 ULVAC, INC.;TANAKA AI;KIRA ATSUSHI;FUWA KOH 发明人 TANAKA AI;KIRA ATSUSHI;FUWA KOH
分类号 H01L21/3065;B81C1/00 主分类号 H01L21/3065
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