| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| 摘要 |
<p>The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation.</p> |
| 申请公布号 |
EP2135910(A1) |
申请公布日期 |
2009.12.23 |
| 申请号 |
EP20080722499 |
申请日期 |
2008.03.19 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MITSUKURA, KAZUYUKI;KAWAMORI, TAKASHI;MASUKO, TAKASHI;KATOGI, SHIGEKI |
| 分类号 |
C09J179/08;C08G59/68;C08L63/00;C09J4/00;C09J4/06;C09J7/02;C09J11/06;C09J163/00;H01L21/301;H01L21/52;H01L23/24 |
主分类号 |
C09J179/08 |
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