| 摘要 |
PURPOSE:To simplify the multiple wirings in a thermal head by forming the wiring of the output unit side in a semiconductor device in a structure for leading from an input unit side, extending the conductor unit of a film carrier to a through hole bump formed in the vicinity of the wirings of the output unit side and utilizing the conductor unit as wirings. CONSTITUTION:An integrated circuit which is composed of an output transistor 32, an output drive unit 33, a logic circuit 34 including a latch and a shift register, etc. and an input circuit 35 is formed on the upper surface of a semiconductor device 7. Bumps 51'', 53'', 25'' are respectively provided at the transistor 32, the unit 33 and an input terminal 25, and the bumps are electrically connected therebetween via the conductors of the film carrier. Since the conductors are raised upward by the projected bumps, they are not contacted with the integrated circuit on the semiconductor device 7 at the part except the bumps, and no shortcircuit occurs. |
