COPPER FOIL FOR PRINTED CIRCUIT BOARD AND COPPER CLAD LAMINATE PLATE FOR PRINTED CIRCUIT BOARD

摘要

Disclosed is a copper foil for a printed circuit board comprising a roughened surface of a copper foil, a layer containing nickel and zinc or compounds of nickel and zinc (hereinafter referred to as a "nickel zinc layer"), and a chromate film layer on the nickel zinc layer.  The copper foil is characterized in that the weight of zinc deposited per unit area of the copper foil in the nikel zinc layer is not less than 180 µg/dm2 and not more than 3500 µg/dm2, and the proportion of the weight of nickel in the plating film, i.e., {weight of nickel deposited/(weight of nickel deposited + weight of zinc deposited)} is not less than 0.38 and not more than 0.7.  The above constitution can establish a surface treatment technique of a copper foil, which can effectively prevent a circuit erosion phenomenon when a copper foil is stacked on a resin base material and a circuit is subjected to soft etching with a sulfuric acid/hydrogen peroxide etching solution.