| 摘要 |
PURPOSE:To integrate chips by means of highly reliable wire junction by a method wherein multiple semiconductor chips with multiple junction pads for single external leading electrode are contained in the same vessel. CONSTITUTION:A conventional emitter leading out pad 4 and a base leading out pad 6 are respectively provided with emitter pads 8 and base pads 9 for connecting to adjoining elements. A pair of unit transister chips 1 are placed on a collector lead 14 in a package 10 in parallel while an emitter pad 4 on each chip 1 is connected to a bridge 16 of an emitter lead 15 in the package and the base pad 6 is connected to a base lead 17. On the other hand, each chip 1 respectively connects the pads 8 and the other pads 9 as shown by connections 12, 13. Through these procedures, an integrated device with high reliability and equal characteristics even at parallel connection may be produced since each connection is junctioned to separate pad evenly and firmly. |
