发明名称 Layer-thickness restriction member, developing device, method for manufacturing restriction blade, and blade-forming mold
摘要 A layer-thickness restriction member, including: an abutting surface that is for abutting against a developer-bearing body in order to restrict a layer thickness of developer borne by the developer-bearing body; and a flash that is located on a side close to a non-abutting surface that is located on an opposite side from the abutting surface in a thickness direction of the layer-thickness restriction member.
申请公布号 US7636538(B2) 申请公布日期 2009.12.22
申请号 US20070741636 申请日期 2007.04.27
申请人 SEIKO EPSON CORPORATION 发明人 OKAMOTO KATSUMI;SATO HIDETOSHI
分类号 G03G15/08;G03G15/09;G03G21/00 主分类号 G03G15/08
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