| 摘要 |
The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: <?in-line-formulae description="In-line Formulae" end="lead"?>X-(CH<SUB>2</SUB>)<SUB>n</SUB>-SH<?in-line-formulae description="In-line Formulae" end="tail"?> wherein n is 2 or 3 and X is SO<SUB>3</SUB>H or NH<SUB>2</SUB>, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.
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