| 摘要 |
A wafer inspection system and method is disclosed. On embodiment includes an edge defect detection unit, an optical inspection unit and a processor unit. The edge defect detection unit is configured to detect defects occurring in an edge area of the wafer and to record edge defect positions. The optical inspection unit is configured to capture images of functional devices in a functional area of the wafer surrounded by the edge area and to record device defect positions related to the functional devices. The processor unit is configured to output a data set relating the edge and device defect positions to the same coordinate system.
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