| 摘要 |
A heat radiating unit provided in an electronic apparatus includes: a fan for blowing air; and a heat radiating member in which heat radiation fins for transmitting heat to passing air are arranged and which has an endothermic section that contacts a top surface of a first heat-producing component on a circuit substrate so as to absorb heat from the first heat-producing component. The heat radiating unit further includes a supporting member provided with a heat-radiating-member biasing section that biases the heat radiating member toward the circuit substrate. The supporting member is also provided with an endothermic arm that extends toward and contacts a top surface of a second heat-producing component so as to absorb heat from the second heat-producing component. The top surfaces of the first and second heat-producing components are different in height.
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