发明名称 Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
摘要 A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.
申请公布号 US7636231(B2) 申请公布日期 2009.12.22
申请号 US20080055467 申请日期 2008.03.26
申请人 INTEL CORPORATION 发明人 GUZEK JOHN S.;PALANDUZ CENGIZ A.;PROKOFIEV VICTOR
分类号 H01G4/06 主分类号 H01G4/06
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